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Symbolic description in the technical parameters of the thyristor for induction furnace
VDRM: off-state repeat peak piezoelectric
VRRM: reverse repeat peak voltage
VDSM: Off-state does not repeat peak voltage
VRSM: Reverse peak voltage is not repeated
VTM: On-state peak voltage
VTO: On-state threshold voltage
VISO: module insulation voltage
VGT: gate trigger voltage
IT (AV): On-state average current
IF (AV): positive average current
IDRM: Off-state repeat peak current
IRRM: Reverse Repeated Peak Current
ITRMS: On-state current RMS
ITM: On-state peak current
ITSM: Forward a non-repetitive surge current (peak)
IGT: Gate trigger current
IH: Maintain current
I2t: current squared time product
Tq: turn off time
Trr: reverse recovery time
THS: radiator temperature
Tj: working junction temperature
Tjm: rated junction temperature
Tg: ambient junction temperature
Dv/dt: critical rate of critical state of off-state voltage
Di/dt: critical rate of on-state current
Rt: On-state slope resistance
Rth(j-hs): thermal impedance (junction to heat sink)
Rth(j-C): Thermal impedance (junction to component package)
Qr: reverse recovery charge
L*p: light trigger sensitivity
One-way thyristor components:
On-state average current IT: In a circuit with a single-phase power frequency sinusoidal half-wave of a resistive load and a conduction angle of not less than 170 degrees at an ambient temperature of +40 ° C and a specified cooling condition, when the junction temperature is stable, The maximum on-state average current allowed when the rated junction temperature is exceeded.
The off-state does not repeat the peak voltage VDSM: the off-state peak voltage at the sharp bend of the forward volt-ampere characteristic curve when the gate is open.
The off-state repetition peak voltage VDRM is 90% of the peak voltage of the off-state.
The off-state does not repeat the average current IDS: When the gate is open, the average leakage current at the peak voltage is not repeated at the rated junction temperature.
The off-state repeat average current IDR: corresponds to the average leakage current at the off-state repeated peak voltage.
Gate Trigger Current IGT: The minimum gate DC current necessary to fully turn the component on at 6 VDC when the main voltage is at room temperature.
Gate trigger voltage VGT: Gate DC voltage corresponding to the gate trigger current.
The critical rate of rise of the off-state voltage, dv/dt, is the lowest voltage rise rate at which the component transitions from the off state to the on state at the rated junction temperature and gate open.
Two-way thyristor components:
On-state current IT: In a single-phase power frequency sinusoidal half-wave circuit with resistive load at ambient temperature of +40 ° C and specified cooling conditions, the maximum allowed when the junction temperature is stable and does not exceed the rated junction temperature The on-state current RMS value.
Switching current critical drop rate (di/dt)c: The maximum on-state current drop rate allowed when the component transitions from an on-state to the opposite direction.
Gate Trigger Current IGT: The minimum gate DC current required to fully open the component when the main voltage is 12 VDC at room temperature.
Fast thyristor components:
Gate control turn-on time tgt: The time required for the main voltage to drop to a predetermined low value from a predetermined point on the leading edge of the gate pulse when the device is turned off from the off state to the on state at a predetermined gate pulse current at room temperature.
Circuit commutation turn-off time tq: The time interval from the moment the on-state current drops to zero, to the moment when the component begins to withstand the specified off-state voltage.